Type-C 24-Pin Vertical SMT Receptacle Technical Specification
The Type-C 24-pin vertical SMT receptacle is a high-reliability interconnect solution engineered for USB 3.1 Gen 2 (10Gbps) SuperSpeed+ and USB Power Delivery (PD) 3.0 compliance. Designed for mission-critical applications in portable power banks, new energy systems, laptops, and industrial automation, it features modular height configurations (13.0/13.5/15.0/20.0mm±0.15mm), robust signal integrity, and MIL-grade material construction. Critical specifications are detailed as follows:
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I. Mechanical Configuration
1. Height Variants & Topology
- Z-axis stack heights: 13.0mm (ultra-low-profile consumer electronics), 13.5mm (high-density PCB assemblies), 15.0mm (standard embedded systems), 20.0mm (industrial backplane installations).
- ±0.1mm coplanarity tolerance for SMT reflow compatibility (J-STD-020E).
2. Vertical SMT Footprint
- JEDEC MO-220 compliant vertical mounting with 0.8mm pitch.
- Dual-row 24-pin full-matrix contacts (12+12 staggered layout) per USB Type-C 2.1 pinout.
3. Mechanical Endurance
- Stainless steel shell with dual-stage retention mechanism:
- Initial mating force: 0.5-0.8kgf (USB-IF TP-201 revision)
- 10,000-cycle durability (IEC 60512-9-3, 25mm/s mating speed)
- Optional PCB retention:
- L-shaped through-hole anchors (0.6mm thickness)
- 4-post anti-vibration fixation (IEC 60068-2-6 compliant)
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II. Electrical Characteristics
1. High-Speed Signaling
- USB 3.1 Gen 2 differential pairs: 4x TX/RX channels @ 10Gbps (S-parameters compliant to USB Type-C 2.1)
- DisplayPort Alternate Mode support: HBR3 (8.1Gbps per lane) for 4K@60Hz
2. Power Delivery System
- VBUS rating: 30VDC/3A (base), 20VDC/5A with e-Marker IC (PD 3.0 PPS)
- CC channel configuration: Rp/Rd termination per USB PD 3.1
3. Key Parameters
- Contact resistance: ≤30mΩ @ 100mA (EIA-364-23)
- Insulation resistance: ≥100MΩ @ 500VDC (IEC 60664-1)
- Withstanding voltage: 250VAC RMS, 60s (UL 1977)
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III. Material Engineering
1. Conductive Components
- Shell: SUS304 stainless steel with nickel plating (1μm thickness), 48hr salt spray resistance (ASTM B117)
- Contacts: C5191R-H phosphor bronze, selective hard gold plating (0.76μm min, IPC-4552 Class 2)
2. Dielectric System
- Insulator: LCP (liquid crystal polymer) housing, UL 94V-0 rated, CTI 600 (IEC 60112)
- Halogen-free compound: ≤900ppm Br/Cl (IEC 61249-2-21)
3. Environmental Compliance
- Operating temperature: -30°C to +85°C (storage: -40°C to +105°C)
- 85°C/85%RH damp heat endurance: 96hr (IEC 60068-2-78)
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IV. Application Matrix
- Consumer Electronics:
- 13.0mm: Ultrabooks/portable power banks with USB4™ backward compatibility
- 13.5mm: New energy vehicle charging interfaces
- Industrial Systems:
- 20.0mm: DIN-rail controllers/IP67-rated medical devices (IEC 60601-1)
- AV Infrastructure:
- 15.0mm: Thunderbolt™ 4 docking stations with DP 2.0 alt mode
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Certifications & Compliance
- USB-IF TID Certified (USB Type-C 2.1, PD 3.1)
- IEC 61076-3-118 mechanical interoperability
- RoHS 2.0/REACH SVHC/China RoHS 2.0 compliant
