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Analysis of Stamping Process and Technical Requirements for Type-C Connectors

Analysis of Stamping Process and Technical Requirements for Type-C Connectors

Publish: 2025-03-22 10:31:07 View: 111
As a widely used interface in modern electronic devices, the stamping process of Type-C connectors is the core link in the manufacturing process. The quality of stamping process directly determines the dimensional accuracy, electrical performance, and durability of connectors. This article will provide a detailed analysis of the stamping process and technical requirements for Type-C connectors, providing reference for relevant practitioners.


Stamping process flow
1. Mold design and development
The design of stamping molds is crucial for the production of Type-C connectors. The mold needs to be customized according to the shape, size, and functional requirements of the connector to ensure that it can withstand the pressure and friction of high-speed stamping. Mold materials are usually made of high hardness steel to improve durability and accuracy.


2. Material selection and processing
The terminals of Type-C connectors are usually made of highly conductive materials such as copper alloys or tin bronze to ensure good electrical performance and mechanical strength. The material needs to undergo strict screening and surface treatment, such as gold plating or nickel plating, to improve corrosion resistance and conductivity.


3. Stamping forming
Stamping forming is the core step in the manufacturing of Type-C connectors. By using a high-speed stamping machine, copper strips and other materials are stamped into the preliminary shapes of terminals and casings. During the stamping process, it is necessary to strictly control the pressure and speed to avoid material deformation or cracking.


4. Subsequent processing

After stamping, further processing such as deburring and marking is required to ensure that the appearance and function of the connector meet the requirements. Deburring is to remove sharp edges generated during the stamping process, while marking is used to identify product information.




technical requirement
1. Dimensional accuracy
The dimensional accuracy of Type-C connectors directly affects their compatibility with equipment and electrical performance. During the stamping process, it is necessary to ensure that the dimensional error of each terminal and housing is controlled at the micrometer level to meet high-precision requirements.


2. Surface treatment
The surface of the terminal needs to be treated with electroplating, such as gold plating, nickel plating, or tin plating, to improve conductivity, corrosion resistance, and soldering performance. The thickness and uniformity of the electroplating layer must comply with industry standards to ensure the reliability of the product during long-term use.


3. Material properties
Stamping materials need to have high conductivity, corrosion resistance, and mechanical strength to ensure the stability of connectors in high-frequency insertion and complex environments. The selection and processing of materials must undergo rigorous testing to meet the high-performance requirements of Type-C connectors.


4. Production efficiency and cost control
On the premise of ensuring quality, it is necessary to improve production efficiency and reduce production costs by optimizing mold design, introducing automation equipment, and other means. For example, using high-precision CNC machine tools and automated testing equipment can reduce manual operation errors and improve the stability of the production line.


  The stamping process of Type-C connectors is a precise and complex technology that involves multiple stages such as mold design, material selection, stamping forming, and subsequent processing. Through strict technical requirements and process control, the high precision, high performance, and high reliability of the connector can be ensured. In the future, with the development of automation technology and new materials, the stamping process of Type-C connectors will be further improved, providing stronger support for the development of electronic devices.
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